MicroLED opens up a new “horizon” for large-screen displays

As the level of informatization and intelligence continues to improve, the demand for large-screen displays and ultra-high-definition displays continues to rise in various application scenarios such as command and dispatch centers, high-end conference rooms, digital billboards, and even home theaters. At the same time, users’ requirements for visual experience are also increasing day by day, which places higher demands on existing display technology.

However, in the face of growing market demand, when existing display technologies such as LCD and OLED are applied to the field of large-screen display, their inherent bottlenecks have gradually emerged. In contrast, Micro LED technology, with its inorganic self-luminous properties, has shown significant advantages in improving display consistency, brightness and lifespan, and therefore has development potential in large-screen display applications.

Micro LED large-screen display products continue to emerge

Micro LED technology has the advantages of ultra-high display performance, unlimited splicing expansion and nearly zero-stitching design, which can well meet the market demand for large-screen displays. As a key technology path to realize large-screen display, Micro LED effectively solves the problem of traditional display in large-scale display through modular design. Technical bottlenecks in inch expansion and seam control.

High-end large-screen display products on the market have already seen the application of Micro LED technology. For example, Samsung's The Wall series and Sony's Crystal LED series both bring stunning visual experiences with Micro LED technology. Domestic manufacturers such as Ledman Optoelectronics have also launched products such as the 163-inch 8K Micro LED ultra-high-definition home giant curtain wall, demonstrating the development potential of Micro LED technology in providing ultra-large display sizes and ultimate resolution.

Ledman Micro LED ultra-high-definition giant screens are used in places such as home, catering and tourism industries to display products and assist introductions.

In the field of automotive display, although Micro LED technology is not yet fully mature, manufacturers are still promoting the implementation of transparent screen applications. BHTC, an automotive display subsidiary of AUO, exhibited a smart cockpit display solution based on Micro LED at the CES show. Among them, the "Phantom Panoramic Canopy" seamlessly integrates a large-scale transparent Micro LED display into the sunroof, bringing an immersive experience. At the same time, the sunroof and side windows can be linked and support transparency adjustment.

The "phantom panoramic canopy" requires extremely high-density and precise integration on the substrate, which poses unprecedented challenges to the core manufacturing process - mass transfer technology. This is also one of the key bottlenecks currently restricting the large-scale application of Micro LED.

In order to overcome the core problem of massive transfer, the industry is actively exploring and innovating from multiple dimensions such as materials, equipment, processes, and architecture, striving to achieve technological breakthroughs and accelerate the industrialization process.

Some companies choose to focus on improving or innovating the mass transfer process itself. For example, the new generation of black diamond technology released by Leyard uses a self-developed laser mass transfer process, which significantly improves transfer efficiency and system stability, and can meet the needs of complex application scenarios such as high-end displays.

BOE continues to promote the internal development and verification of mass transfer technology by cooperating with internationally renowned equipment and materials companies and planning to build a 2.5-generation mass transfer pilot line.

In addition, further miniaturization of LED light-emitting chips is an effective way to reduce the cost of Micro LED and achieve higher PPI, which also directly affects the required mass transfer technology route and substrate selection.

For micro-pitch displays below P1.0, the technology routes mainly explored by the industry include PCB substrate-based COB technology, glass-based AM/PM driven COG technology, and MiP new packaging routes. Focusing on these technical routes and different application requirements, many companies are conducting technical research from the packaging, substrate or backplane levels, and solving the corresponding massive transfer problems.

Packaging manufacturers such as Nationstar Optoelectronics, Hongli Zhihui, Ruifeng Optoelectronics, etc. are making efforts. Among them, Nationstar Optoelectronics has made progress in module integration based on AM drivers. Its self-developed 10-inch AM Micro LED full-color module has achieved a breakthrough in mass transfer technology and accelerated the move to 4K/8 K ultra-high definition commercial field expansion.

In the field of MiP packaging technology, Leyard took the lead in carrying out strategic layout. The Hi-Micro product launched by the company uses a substrate-less Micro LED chip with a short side size of less than 30 μm, reflecting the latest progress in MiP technology.

Unilumin Technology simultaneously laid out the two major technical routes of MiP and COB. Relying on vertically integrated industrial chain resources, it invested in the construction of a semiconductor-grade MiP packaging and testing production line, achieved mass production of MiP 0202 lamp beads, and launched P0.4 pitch MiP display products.

Since Ledman Optoelectronics launched MiP technology pre-research in 2021, Micro-level MiP technology has matured and achieved small-volume trial production by 2024, and launched the first COB display product based on Micro-level MiP devices.

It is reported that Ledman Optoelectronics is actively exploring COB and glass-based technologies. The company has successively mastered COB formal packaging, flip-chip and other processes, and worked with upstream partners to build a PM drive structure + glass substrate solution, overcoming huge through holes, thick copper, etc. Key technologies related to glass substrates have solved some of the inherent defects of glass substrates, and pilot bases are currently being built for exploration and upgrading.

For specific scenarios such as borderless splicing, Shentianma uses LTPS technology combined with GOA in pixel design to realize a P0.15mm ultra-narrow bezel backplane. Such solutions also put forward requirements for the high-precision mass transfer of Micro LED chips to complex LTPS backplanes, which Shentianma supports through technologies such as double-sided wiring and Cu processes.

In addition to process and substrate/packaging innovation, some companies are also seeking breakthroughs from the chip architecture, performance, etc. or system integration level.

Innolux has teamed up with American Micro LED company eLux to use color conversion technology to replace the traditional RGB chip layout. This reduces the types and quantities of chips that need to be transferred, simplifies the mass transfer and subsequent maintenance process, and improves display uniformity, helping to reduce production costs and improve yield rates.

Chenxian Optoelectronics focuses on systematic technology integration and has achieved mass transfer, drive architecture, seamless splicing and Overcoming key technologies such as hybrid bin, we have independently developed many innovative achievements such as high-speed mass transfer technology, glass-based TFT hybrid drive solution, TFT-based double-sided LTPS-TFT backplane technology, and hybrid assembly technology.

On the upstream chip side, by optimizing the light efficiency of Micro LED chips and improving the transfer yield, Fucai is laying a more solid foundation from the source for downstream manufacturers' massive transfer and final application.

As the results achieved by these companies show, by continuing to carry out technical research and explore diversified paths in multiple dimensions such as mass transfer process, chip design, material innovation, new packaging and system integration, the industry is gradually breaking through the core bottleneck of mass transfer and related problems, laying the foundation for the large-scale application and industrial development of Micro LED.

Micro LED industrialization process has accelerated significantly

Currently, Micro LED technology is accelerating the industrialization process at an unprecedented speed, and many companies have made important breakthroughs in building new production lines, increasing production capacity, and expanding market applications. Worth shutting down It should be noted that in the direction of large-screen display, panel manufacturers with the advantages of glass substrates are playing an increasingly critical role.

In promoting the industrialization of Micro LED, one of the main strategies is to build industrial advantages through deep binding or vertical integration with the upstream chip side. Through strategic holdings of BOE Huacan Optoelectronics and supporting Zhuhai Jingxin's downstream module projects, BOE has built BOE Huacan Optoelectronics' 6-inch Micro LED mass production line and Zhuhai Jingxin MLED module line. These two production lines will achieve mass production and product delivery in March 2025 respectively.

BOE Huacan is working closely with the official delivery of Micro LED factory products and is building the world's highest generation 4.5-generation Micro LED production line, which is planned to be put into mass production in 2025.

The other is to pool resources by establishing a specialized entity to efficiently promote the research and development and industrialization of Micro LED technology. TCL Huaxing and Sanan Optoelectronics jointly established Xinying Display, focusing on key technologies such as transfer bonding. Its Micro LED pilot line has been completed in October 2024 and is expected to be trial-produced in small batches in 2025; Visionox spun off and established Chenxian Optoelectronics, focusing on Micro LED technology based on TFT glass substrates, and successfully lit up the first TFT-based Micro LED in mainland China in December 2024. LED mass production line; Innolux Optoelectronics has established a subsidiary company, Qunchao Display Technology, focusing on Micro LED R&D and manufacturing. It is planning to put Micro LED products into production on the 3.5-generation LTPS production line first.

In addition, there are manufacturers such as Shentianma, which mainly rely on their existing panels such as LTPS glass substrates. It has technological advantages and built corresponding production lines to accelerate application development. Its G3.5 generation Micro LED production line with an investment of 1.1 billion yuan has successfully completed the entire process in December 2024, focusing on automotive, PID and other applications.

In addition to panel manufacturers, traditional LED packaging and application companies are also actively promoting the industrialization of Micro LED technology, especially making significant progress in increasing production capacity and expanding market applications.

Leyard's first full-process self-developed new generation high-end MIP production line has been officially put into production at Wuxi Lijing Factory on November 20, 2024. This production line focuses on the production of high-end MIP products using full flip-chip substrate-less Micro LED chips smaller than 50μm. The first phase production capacity reaches 1200KK/month, and the planned second phase will further expand to 2400KK/month.

Leyard's first full-process self-developed new generation high-end MIP production line

TrendForce 2025 Global LED display market outlook and price and cost analysis

Publication date: September 30, 2024
Language: Chinese/English
Format: PDF
Number of pages: 253 pages

TrendForce 2024 Micro LED market trends and technology cost analysis-2H24

Report language: Chinese / English
Number of report pages: 160 pages
Publication date: May 31 / November 30, 2024
Research field: Micro LED