Both lines work together to lead the MIP | AET Altai releases new Micro and Mini MIP products

Let the advantages of the whole chain become a reliable and solid guarantee for customers;

Let cutting-edge technology become a real experience visible to customers;

Let leading products become a value engine that customers can use.

In 2026, AET Altai officially launched the NX MIP series of blockbuster new products - covering the two product lines of Micro-level MIP and Mini-level MIP, achieving a complete layout from extreme display to large-scale applications.

This is not only the shocking debut of two new products, but also two new value engines on the MIP track - Micro-level definition and Mini-level empowerment scale. Both lines work together to help customers gain a leading edge in market competition and gain lasting trust in user experience.

To fully interpret the value of these two new products, we must first understand the technical base they share - MIP.

MIP: From "sticking lamp beads" to "sealing chips" - the technological transition of chip-level packaging

MIP, the full name of Mini/Micro LED in Package, its core concept is: first package the Mini/Micro LED chip into an independent light-emitting unit, and then solidify/mount it into a display module.

The biggest difference from traditional SMD and other technologies is that the core of MIP has shifted from "lamp beads" to "chip-scale packages".

In layman's terms, SMD and IMD are "lamp beads attached", while MIP is "chips sealed in".

In terms of packaging technology, MIP adopts a flip chip + die welding structure, abandoning the gold wire bonding process, making the packaging more compact and reliable.

This brings three significant changes:

▸ Smaller and more precise: supports ultra-fine pitch display of P0.4 and below;

▸ Higher reliability: the package provides structural protection for the chip and has better stress resistance;

▸ Better light color effect: MIP lamp beads can be mixed crystals and light and color separated to achieve better light color consistency.

MIP is not only an upgrade of the packaging process, but also a key technology connecting the existing Mini LED industry system with future Micro LED displays.

Currently, in the ultra-fine pitch field of P0.6 and below, COG, COB and other solutions are limited by bottlenecks such as mass transfer yield, and large-scale mass production still faces challenges. MIP uses advanced packaging processes to pre-form Micro LED chips into tiny packages, becoming the current pioneering solution for achieving stable mass production of Micro displays.

Based on the differences in chip size and substrate processing technology, MIP can be divided into two technical paths: Mini-level MIP and Micro-level MIP. The core difference between the two lies in the chip size and whether to peel off the sapphire substrate.

01

Mini-level NX MIP: mature and reliable, accelerating large-scale application

Mini-level MIP uses Mini LED flip-chip chips with a size ranging from 100μm to 300μm without peeling off the sapphire substrate, and is made into a MIP package through solid chip packaging. The technical difficulties focus on the front-end packaging process - how to efficiently and stably seal the Mini chip into the MIP package.

The core advantages of the Mini-level MIP solution include:

▸ High packaging efficiency: three RGB chips are transferred at the same time during one die bonding operation, which increases the efficiency by three times;

▸ Low process requirements and high yield: MIP package size, pin and GAP spacing are larger than those of flip-chip Mini LED chips, and the requirements for PCB board precision and die bonding accuracy are lower, which is conducive to improving the overall yield;

▸ Optimization of display effects: Mixed crystals can be achieved to improve display uniformity and reduce the process of secondary sorting of modules.

AET Altai Mini-level NX MIP new product highlights

►Point pitch P1.25, brightness 1000nits, refresh rate 3840Hz, rich picture levels and smooth dynamics;

►MIP+GOB package, the display surface protection level reaches IP65, the chip is protected by the package, with higher reliability and longer life;

►A single complete machine is independently packaged, ensuring product transportation safety in all aspects, enjoying a quality experience right out of the box, and achieving efficient deployment;

►Supports wireless hard connection and hot swapping, full front-end maintenance of the module, and dual backup of power and signal are optional;

►Completely adaptable to large-scale application scenarios such as conference centers, commercial displays, and high-end retail.

02

Micro-level NX MIP: Ultimate display, defining flagship standard

When the chip size is reduced to the Micro level, if it is directly used in LED display modules, it will face problems such as difficulty in circuit connection, low yield, and poor chip reliability. And when the chip size is further reduced to 100μm, the traditional wafer grinding and thinning process with sapphire substrate will become a process bottleneck, and grinding cracks will easily occur, causing the chip yield to be less than 50%, making it difficult to achieve mass production. Therefore, it is necessary to introduce a laser lift-off sapphire substrate process.

The Micro-level MIP uses ultra-small-size Micro RGB chips peeled off the sapphire substrate, achieving a true "chip-scale packaging".

In terms of packaging structure, Micro-level MIP follows the flip-chip + die-bonding solution. Through "pre-packaging", micron-level chips are integrated into MIP packages with stable structure and larger size through advanced packaging processes, simplifying the back-end manufacturing process and solving pain points such as rework, yield, and production line compatibility.

The key challenges of this technology path are mainly focused on the back-end process of the chip manufacturing process-how to efficiently peel off the sapphire substrate, and how to break through the technical bottleneck of mass transfer of Micro chips. Due to the high cost and complex manufacturing process of Micro LED chips, this technology is still in the climbing stage and has not yet achieved large-scale popularization and application.

The core advantages of the Micro-level MIP solution include:

▸Excellent optical performance: after peeling off the sapphire substrate, the chip thickness is <10μm, the viewing angle is >170°, the RGB chip area and spacing are reduced, the light mixing effect is better, no color cast, no blue and yellow lines;

▸Excellent display effect: no gold wire obstruction, smaller chip and larger black area, easily achieving an ultra-high contrast ratio of >10000:1;

▸High reliability: no substrate, no soldering wires, integrated design of PAD and circuits, avoiding reliability problems such as metal migration.

AET Altai Micro-level NX MIP new product highlights

►Point pitch P0.78, P0.93, 3840-7680Hz high refresh rate, 13-16bit gray scale;

►Supports 1200nits brightness, 12000:1 ultra-high contrast, delicate picture, full color;

► "Nano black" surface treatment technology + substrate-less light-emitting IC design, the purity of the black screen is greatly improved, and the visual effect is deep and transparent;

►170° ultra-wide viewing angle, IP65 protection level, waterproof, dustproof, anti-collision, adaptable to harsh environments;

►Supports wireless hard connection, hot-swappable, full front maintenance, dual power and signal backup optional;

► Easily achieve standard resolutions of 2K/4K/8K and above, and support customized appearance of the back cover.

From the maturity and reliability of Mini-level MIP to the ultimate display of Micro-level MIP, AET Altai relies on the advantages of the entire industry chain integrating chips, packaging, and applications to take the lead in realizing dual-line mass production and commercialization of MIP technology.

NX MIP series officially launched.

Whether you are pursuing ultimate picture quality, scale efficiency, or seeking differentiated competitive advantages, AET can fully meet the diverse needs of customers with its multi-level product matrix and industry solutions.

We are willing to work side by side with every partner to jointly lead the new evolution of the vision.

AET

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