On the evening of June 3, Chongqing Zhenbao Technology Co., Ltd. disclosed a prospectus and plans to issue 38.8226 million A shares for the first time on the Shanghai Stock Exchange Science and Technology Innovation Board, planning to raise 1.198 billion yuan. June 9th is the preliminary inquiry day, an online roadshow will be held on June 11th, June 12th is the subscription day, and June 16th is the payment day.
According to the prospectus, Zhenbao Technology focuses on providing customers in the integrated circuit and display panel industries with components and surface treatment solutions that participate in process reactions in the vacuum chamber of manufacturing equipment. The company's component products and surface treatment services are mainly used in semiconductor equipment for plasma etching, thin film deposition and other processes in the integrated circuit industry and panel manufacturing equipment for plasma etching, thin film deposition and evaporation processes in the display panel industry.
During the reporting period, the company has established long-term and stable cooperative relationships with domestic mainstream display panel manufacturers such as BOE, TCL CSOT, Tianma Microelectronics, Huike Co., Ltd. and Rainbow Optoelectronics.
From 2022 to 2025, Zhenbao Technology achieved operating income of 386 million yuan, 506 million yuan, 635 million yuan and 868 million yuan respectively; net profits attributable to the parent company were 81.6216 million yuan, 1.08 million yuan, respectively. 100 million yuan, 152 million yuan and 226 million yuan; in the first quarter of 2026, the company achieved operating income of 223 million yuan and net profit attributable to the parent company of 51.0255 million yuan, with increases of 34.93% and 72.38% respectively.
The funds raised from this IPO, after deducting issuance expenses, will be invested in semiconductor and pan-semiconductor precision parts and material production base projects, R&D center construction projects, and Shanghai Zhenbao Semiconductor Equipment Parts R&D Center projects.
Zhenbao Technology stated that through this listing, the company can increase its investment in independent research and development of key raw materials, expand the product system of key semiconductor components, enhance the company's core competitiveness and brand influence, accelerate the localization of domestic semiconductor components, fill the technical gaps in the field of domestic semiconductor materials and components, solve the problem of stuck necks in advanced process integrated circuit manufacturing components, help improve the domestic supply chain system and independently control it, and ensure the stable and sustainable development of the integrated circuit manufacturing industry.
Contact: James Zhang
Phone: +86 13823393905
E-mail: jnjdz@jnjdz.com
Add: 2nd Floor, Building 4.Qiangrong East hdustrial Zone, JuweiCommunity,HangchengStreet, Eao'an District, ShenZhen